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Editorial Board

Wing-Kin (Ken) Ma Editor-in-Chief:
Wing-Kin (Ken) Ma
The Chinese University of Hong Kong
Email EiC
Email SPS Publications Office
Term Ends: 31 December 2023




Senior Area Editors

Name Affiliation
Karim Abed-Meraim Université d’Orléans, Polytech Orléans, France
Pierre Borgnat CNRS, ENS de Lyon, France
Remy Boyer University of Lille, France
Tsung-Hui Chang The Chinese University of Hong Kong, China
Vaughan Clarkson The University of Queensland, Australia
Mark Davenport Georgia Institute of Technology, USA
Cédric Févotte CNRS, University of Toulouse, France
Yuantao Gu Tsinghua University, China
Y.-W. Peter Hong National Tsing Hua University, Taiwan
Lei Huang Shenzhen University, China
Andreas Jakobsson Lund University, Sweden
Marco Lops University of Naples Federico II, Italy
Gonzalo Mateos University of Rochester, USA
John McAllister Queen’s University Belfast, United Kingdom
Xavier Mestre Centre Tecnològic de Telecomunicacions, Spain
Marco Moretti University of Pisa, Italy
Chandra Murthy Indian Institute of Science, India
Yue Rong Curtin University, Australia
Gesualdo Scutari Purdue University, USA
Dimitri Van De Ville University of Geneva, Switzerland
Wenwu Wang University of Surrey, United Kingdom
Xin Wang Fudan University, China

Associate Editors

Name Affiliation
Evrim Acar (Ataman) Simula Research Laboratory, Norway
Pia Addabbo Università Giustino Fortunato, Italy
George Atia University of Central Florida, USA
Augusto Aubry Universita' Degli Studi di Napoli Federico II, Docenti, Italy
Behtash Babadi University of Maryland, USA
Lin Bai Beihang University, China
Monica Bugallo Stony Brook University, USA
Andreas Burg Ecole Polytechnique Federale de Lausanne (EPFL), Switzerland
Bo Chen Xidian University, China
Yuejie Chi Carnegie Mellon University, USA
Emilie Chouzenoux INRIA Saclay, CentraleSupélec, France
Kobi Cohen Ben-Gurion University of the Negev, Israel
Laurent Condat King Abdullah University of Science and Technology (KAUST), Saudi Arabia
Subhro Das IBM Research, USA
Justin Dauwels TU Delft, Netherlands
Nicolas Dobigeon University of Toulouse, France
Marco F. Duarte University of Massachusetts Amherst, USA
Victor Elvira University of Edinburgh, UK
Xiao Fu Oregon State University, USA
Lorenzo Galleani Polytechnic University of Turin, Italy
Nicolas Gillis University of Mons, Belgium
Vincent Gripon IMT Atlantique Bretagne-Pays de Loire, France
Aboulnasr Hassanien Wright State University, USA
Jarvis Haupt University of Minnesota, USA
Mingyi Hong University of Minnesota, USA
Yuan-Hao Huang National Tsing Hua University (NTHU), Taiwan
Laurent Jacques ICTEAM Institute at UCLouvain, Belgium
Xue Jiang Shanghai Jiao Tong University, China
Sheetal Kalyani IIT Madras, India
Abla Kammoun Supelec, France
Usman A. Khan Tufts University, USA
Sangarapillai Lambotharan Loughborough University, UK
Gang Li Tsinghua University, China
An Liu Zhejiang University, China
Yue Lu Harvard University, USA
David Morales University of Málaga, Spain
Michael Muma Technische Universität (TU) Darmstadt, Germany
Shogo Muramatsu Niigata University, Japan
Mohsen Naqvi Newcastle University, UK
Tokunbo Ogunfunmi Santa Clara University, USA
Vasanthan Raghavan Qualcomm Flarion Technologies, USA
Ketan Rajawat Indian Institute of Technology Kanpur, India
Chiara Ravazzi National Research Council of Italy (IEIIT-CNR), Italy
Meisam Razaviyayn USC, USA
Florian Römer Fraunhofer Institute, Germany
David Shuman Macalester College, USA
Mojtaba Soltanalian University of Illinois at Chicago (UIC), USA
Ali Tajer Rensselaer Polytechnic Institute, USA
Vincent Tan National University of Singapore, Singapore
Bo Tang National University of Defense Technology, China
Gongguo Tang University of Colorado Boulder, USA
Cihan Tepedelenlioglu Arizona State University, USA
Pascal Vallet Bordeaux INP, France
Ba-Ngu Vo Curtin University, Australia
Michael Wakin Colorado School of Mines, USA
Irene Waldspurger Université Paris-Dauphine, France
Hsiao-Chun Wu Louisiana State University, USA
Yik-Chung Wu The University of Hong Kong, Hong Kong
Yili Xia Southeast University, China
Yao Xie Georgia Institute of Technology, USA
Weiyu Xu University of Iowa, USA

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